Wiki source code of Explanation: ICM exposed on the surface
Version 1.1 by SuperUwe Trueggelmann on 2022-07-01
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| author | version | line-number | content |
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| 1 | IC Cards are produced in 3 substantially different variants: | ||
| 2 | |||
| 3 | == IC Card produced using an ICM containing the IC and the contacts == | ||
| 4 | |||
| 5 | The IC is (die- or flip-chip-) bonded onto a carrier, typically a 35 mm film tape, like shown in below image. The image was published on nedcard.com. | ||
| 6 | |||
| 7 | [[image:https://www.nedcard.com/hs-fs/hubfs/DIF%2020120305_020.jpg?width=571&height=365&name=DIF%2020120305_020.jpg||alt="Dual Interface.jpg" height="121" width="189"]] | ||
| 8 | |||
| 9 | The IC Module ("ICM") is punched out: | ||
| 10 | |||
| 11 | [[image:https://external-content.duckduckgo.com/iu/?u=https%3A%2F%2Ffareastgizmos.com%2Fwp-content%2Fuploads%2F2008%2F06%2Fsmartcard.jpg&f=1&nofb=1||alt="Samsung announces High Performance Smart Card IC with 90-Nanometer Technology - Fareastgizmos" height="89" width="190"]] | ||
| 12 | |||
| 13 | and embedded into the card using some sort of adhesive, as shown in the below image, which was published on tesa.com. The image shows the ICM on top, adhesive in red, and a white card with a milled cavity to receive the ICM: | ||
| 14 | |||
| 15 | [[image:https://www.tesa.com/en/files/images/201608/5/contact-card,138312_fixedwidth_9.jpg||alt="Contact card" height="125" width="189"]] | ||
| 16 | |||
| 17 | to produce the finished card: | ||
| 18 | |||
| 19 | [[image:https://ae01.alicdn.com/kf/HTB1DtpBRXXXXXXdXpXXq6xXFXXX3/IC-card-smart-card-chip-4442-card-contact-type-ic-card-widely-used-in-consumer-systems.jpg_640x640.jpg||height="126" width="191"]] | ||
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| 21 | If the card is produced like this, then the quality of the adhesive connection of the ICM to the card can be tested. | ||
| 22 | |||
| 23 | In case of uncertainty, an inspection of the edge of the contact surface with a microscope usually shows the punched edge of the ICM and a small gap between the ICM and the edge of the cavity milled into the card to receive the ICM. | ||
| 24 | |||
| 25 | If the card is produced like this, then tick "ICM exposed on the surface". | ||
| 26 | |||
| 27 | == IC Card produced using an Inlay containing the IC and the contacts == | ||
| 28 | |||
| 29 | Some cards are produced from an inlay that already contains the contacts and the IC. A printed sheet is added onto each side of this inlay, and sometimes a clear overlay ontop of the printed sheet. The printed sheet and the overlay have an opening in the area of the contacts to expose them to the surface. After lamination the contact plate on the inlay is exposed on the surface of the card. | ||
| 30 | |||
| 31 | Such cards do not have an embedded ICM, and hence for example testing for ICM adhesion makes no sense. | ||
| 32 | |||
| 33 | In case of uncertainty, an inspection of the edge of the contact surface with a microscope does not show a punched edge around the contact surface, and no clear gap between the ICM and the edge of the cavity. | ||
| 34 | |||
| 35 | If the card is produced like this, then do __not __tick "ICM exposed on the surface". | ||
| 36 | |||
| 37 | == IC Card produced using an Inlay containing the IC, and contact plate connected in a separate process step == | ||
| 38 | |||
| 39 | A third method is sometimes used, primarily to produce cards with interactive functionality, like cards with fingerprint sensors. | ||
| 40 | |||
| 41 | In this case the IC is connected to the inlay, and the inlay also has a connection area for a separate contact plate. | ||
| 42 | |||
| 43 | The card is initially laminated containing the inlay, but does not have contacts exposed on the surface. | ||
| 44 | |||
| 45 | After lamination, a cavity is milled into the card in the location of the contact plate, exposing the connectors for the contact plate, the contact plate is inserted and electrically connected to the inlay, e.g. by soldering or a conductive adhesive. | ||
| 46 | |||
| 47 | In case of uncertainty, an inspection of the edge of the contact surface with a microscope usually shows the punched edge of the contact plate and a small gap between the contact plate and the edge of the cavity milled into the card to receive the contact plate, but after removing the contact plate to determine the strength of its adhesion to the card, it becomes clear that there is no IC on the back of the contact plate. | ||
| 48 | |||
| 49 | If the card is produced like this, then tick "ICM exposed on the surface", but clarify in the test report that the card does not contain an ICM but a separate contact plate. |